EOSL has extensive experience in the design and fabrication of custom packaging for electronic assemblies for stressing applications. Our heritage is based on chip-level combining of IMPATT diodes using natural type IIA diamond heat sinks. We design and fabricate thin film networks and performs dicing operations using a MicroAutomation 1006 dicing saw. We have perfected eutectic and epoxy die attach processes to attach semiconductors and other electronic components to the package base. The microelectronic lab at EOSL uses a Westbond 7400A thermosonic wedge bonding system to interconnect devices using 0.7 mil gold wire. Larger diameter wire and ribbon processes are also available. These assembly processes are performed by our full-time staff, whose wealth of experience enables us to meet customer schedules confidently. 

Example of a Thin-film Network on Alumina
 

Thermosonic Wedge Wire Bonding System